In Tchernov cables, dielectric binding is specially applied over the twisted insulated conductors. Besides individual conductor insulation, additional binding multiplies the overall cable dielectric properties. Innovative binding technologies are what Tchernov Cable is widely renowned for. We developed Standard Dielectric Binding - SDB, and Semi-Air-Spaced Dielectric Binding - SASDB® (Patent RU No.144590U). SDB is a 2-layer bi-directional X-Cross non-polar dielectric tape overlaying process. SASDB® is a 4-layer bi-directional X-cross PTFE (Teflon®) tape overlaying process, where each successor winding of the 3 opposite inner layers is performed with an air gap and the final layer completed with a 30% overlay. This sophisticated method ensures a significant decrease of signal energy losses thanks to the solid dielectric material being partially replaced by air spacing, which offers extremely low and frequency independent relative permittivity. Furthermore, due to the ease of mechanical interlayer tensions, vibrations are absorbed effectively with exceptional flexibility obtained at the same time.